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Passive Chemical Project

Name: Passive Chemical Project
Brand: LAP Lambert Academic Publishing
SKU: 02265664
Price: 73.59 EUR
Availability: InStock
Author: Rajendra Parsad
ISBN: 9783838333373

Project in the past

Rajendra Parsad

Lingua

Inglese

Libro In brossura

Codice Libristo: 02265664

Casa editrice LAP Lambert Academic Publishing, novembre 2013

The corrosion current of bare copper metal was determined in ferric ion and in hydrogen peroxide sol... Descrizione completa

Codice Libristo: 02265664

180 b

73.59 €

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The corrosion current of bare copper metal was determined in ferric ion and in hydrogen peroxide solutions and was found to be close to the CMP rate reported in the literature. This leads to the new conclusion that copper CMP is mainly a corrosive wear process that occurs at the abraded spots on the wafer surface, the high spots. Cu(I)BTA film forms only at the low areas which are not being abraded. This finding calls for the revision of the conventional view that CMP involves a successive sequence of film formation and removal.