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Semiconductor Advanced Packaging

Name: Semiconductor Advanced Packaging
Brand: Springer Verlag, Singapore
SKU: 39124513
Price: 126.09 EUR
Availability: InStock
Author: John H. Lau
ISBN: 9789811613784

John H. Lau

Lingua

Inglese

Libro In brossura

Codice Libristo: 39124513

Casa editrice Springer Verlag, Singapore, maggio 2022

The book focuses on the design, materials, process, fabrication, and reliability of advanced semicon... Descrizione completa

Codice Libristo: 39124513

309 b

126.09 €

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The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.