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Three-Dimensional Integrated Circuit Design
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Three-Dimensional Integrated Circuit Design 2e, expands the original with more than 50% new content, adding new the latest developments in modeling, temperature considerations, power management, memory issues, and heterogeneous integration. 3DIC experts Pavlidis and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Offers practical guidance on designing to exploit 3D implementation flexibilityNew coverage of power distribution with 3D IC’s including a network case study Demonstrates how to use 3D IC within heterogeneous systems that may include a variety of materials, devices, signal processors, GPU-CPU integration, and more
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